Zhang, Dacheng
Professor
Research Interests: Si MEMS fabrication, microstructure parameter extraction, micro sensors
Office Phone: 86-10-6275 5816
Email: dchzhang@ime.pku.edu.cn
Zhang, Dacheng is the Vice Director and a Professor at Institute of Micro electronics, Peking University. Dr. Zhang received his Ph.D degree focusing on MEMS sensors from Peking University in 2004. He joined Peking University in 1993 and became a professor of the School of Electronics Engineering and Computer Science in 2001. Dr. Zhang has lead the Micro/Nano Fabrication platform, a fully equipped 1500㎡clean room, over 20 years. His research interests are on the Silicon MEMS fabrication technology, development of Silicon technology and related equipment, construction of micro-nano technology platforms.
Dr. Dacheng Zhang has more than 30 authorized patents. His notable contributions include developing standardized MEMS device fabrication methods, first Chinese proposer for IEC MEMS standardization (IEC 62047-25, Silicon based MEMS fabrication technology-Measurement method of pull-press and shearing strength of micro bonding area), developing the first integration process of piezo resistive sensor and CMOS integrated circuit, the first integration process of deep etching and CMOS integrated circuit bonding. His innovative research has won him numerous awards including second-class award of State Science and Technology Prizes in China, Beijing Science and Technology Progress Award. One of his researches Space Particle Detector has won first prize for Scientific and Technological Progress in China.
Dr. Dacheng Zhang has more than ten research projects including NSFC, 973 programs, 863 project, etc. His research achievements are summarized as follows:
1) Silicon process based MEMS standard fabrication and integration technology:
He has kept his resolve more than 20 years, whose presiding developed three sets of MEMS standard process has provided hundreds of MEMS chip research projects with fabrication technology service and directly supported domestic top-level micro gyroscope and accelerometer manufacturing. The MEMS and IC integration power has been also owned in the same room, where the process contamination is controlled under 1 PPM (parts per million) and the excellent MEMS and IC compatibility has been highly appreciated by Richard Levin the president of Yale university.
2) MEMS microstructure characteristics evaluation method:
he has taken the lead in the systematical research on process-related bulk silicon mechanical characteristics extraction method of MEMS microstructures, based on which a series of microstructure parameter extraction and process quality control methods have been utilized in MEMS production line. Further more, the technology base has been founded for the MEMS device feature design and reliability research. One international standard IEC 62047-25 and four national standards has been put forward by his research group. IEC 62047-25 is first proposed by the agency of China in MEMS field IEC standards, which has breakthrough significance for China`s MEMS industry development.
3) Nano-scale structure manufacturing technology:
the world-class manufacturing process for nano-scale high-aspect-ratio structure of monocrystalline silicon has been successfully developed, using which monocrystalline silicon nanometer barrel array has been realized, whose wall thickness is 6.7 nm and aspect-ratio is more than 50:1. Facing the 7 nm oriented process node, the fundamental processing capacity has been equipped for the next generation of nano-scale IC research.
